Headers, Male Pins

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Connector Type Contact Type Pitch - Mating Number of Positions Number of Rows Row Spacing - Mating Number of Positions Loaded Style Shrouding Mounting Type Termination Fastening Type Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish - Post Contact Material Insulation Material Features Current Rating (Amps)
SLV W 4 105 48 G

SLV W 4 105 48 G

3,105
RFQ
SLV W 4 105 48 G

Datasheet

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 130 44 G

SLV W 4 130 44 G

1,468
RFQ
SLV W 4 130 44 G

Datasheet

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 44 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 080 4 Z

SLV W 4 080 4 Z

1,025
RFQ
SLV W 4 080 4 Z

Datasheet

SLV W 4 080 Bulk Active Header Male Pin 0.050" (1.27mm) 4 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 3 SMD 073 30 Z

SLV W 3 SMD 073 30 Z

one row expanded insulator 2-20

Fischer Elektronik

3,721
RFQ
SLV W 3 SMD 073 30 Z

Datasheet

SLV W 3 SMD 073 Tube Active Header Male Pin 0.050" (1.27mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 130 32 G

SLV W 4 130 32 G

2,529
RFQ
SLV W 4 130 32 G

Datasheet

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 080 10 G

SLV W 4 080 10 G

4,486
RFQ
SLV W 4 080 10 G

Datasheet

SLV W 4 080 Bulk Active Header Male Pin 0.050" (1.27mm) 10 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 3 SMD 073 12 Z SM

SLV W 3 SMD 073 12 Z SM

one row expanded insulator 2-20

Fischer Elektronik

1,841
RFQ
SLV W 3 SMD 073 12 Z SM

Datasheet

SLV W 3 SMD 073 Tube Active Header Male Pin 0.050" (1.27mm) 12 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 3 SMD 048 3 Z SM

SLV W 3 SMD 048 3 Z SM

one row expanded insulator 2-20

Fischer Elektronik

2,749
RFQ
SLV W 3 SMD 048 3 Z SM

Datasheet

SLV W 3 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 3 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 036 46 G

SLV W 4 036 46 G

3,222
RFQ
SLV W 4 036 46 G

Datasheet

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 105 10 G

SLV W 4 105 10 G

2,866
RFQ
SLV W 4 105 10 G

Datasheet

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 10 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 130 48 G

SLV W 4 130 48 G

3,661
RFQ
SLV W 4 130 48 G

Datasheet

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 1 SMD 073 35 Z

SLV W 1 SMD 073 35 Z

one row, wide isolation body, 4-

Fischer Elektronik

4,710
RFQ
SLV W 1 SMD 073 35 Z

Datasheet

SLV W 1 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 35 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 036 12 Z

SLV W 4 036 12 Z

3,565
RFQ
SLV W 4 036 12 Z

Datasheet

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 12 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 036 56 G

SLV W 4 036 56 G

2,698
RFQ
SLV W 4 036 56 G

Datasheet

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 56 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 2 036 18 Z

SLV W 2 036 18 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

1,797
RFQ
SLV W 2 036 18 Z

Datasheet

SLV W 2 036 Bulk Active Header Male Pin 0.050" (1.27mm) 18 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 SMD 048 52 G

SLV W 4 SMD 048 52 G

3,888
RFQ
SLV W 4 SMD 048 52 G

Datasheet

SLV W 4 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 52 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) - - 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 2 055 66 Z

SLV W 2 055 66 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

1,050
RFQ
SLV W 2 055 66 Z

Datasheet

SLV W 2 055 Bulk Active Header Male Pin 0.050" (1.27mm) 66 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 3 SMD 048 30 G

SLV W 3 SMD 048 30 G

one row expanded insulator 2-20

Fischer Elektronik

4,585
RFQ
SLV W 3 SMD 048 30 G

Datasheet

SLV W 3 SMD 048 - Active Header Male Pin 0.050" (1.27mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 055 24 Z

SLV W 4 055 24 Z

2,779
RFQ
SLV W 4 055 24 Z

Datasheet

SLV W 4 055 Bulk Active Header Male Pin 0.050" (1.27mm) 24 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Tin Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
SLV W 4 130 60 G

SLV W 4 130 60 G

3,138
RFQ
SLV W 4 130 60 G

Datasheet

SLV W 4 130 - Active Header Male Pin 0.050" (1.27mm) 60 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - 1.5A
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