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Home > Products > Connectors, Interconnects > Rectangular Connectors > Headers, Male Pins

Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 9 SMD 102 33 G one row, wide isolation body, 4- Fischer Elektronik	2,203	-	RFQ	Datasheet	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	33	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 102 26 Z one row, wide isolation body, 4- Fischer Elektronik	1,079	-	RFQ	Datasheet	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 28 G one row, wide isolation body, 4- Fischer Elektronik	1,787	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 26 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,701	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 48 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,141	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 4 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,606	-	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	4	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 72 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	4,607	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	72	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 6 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,216	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 18 G SM one row expanded insulator 2-20 Fischer Elektronik	4,258	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 38 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,646	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 30 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,453	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	30	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 36 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,329	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 70 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,286	-	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 62 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,445	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 24 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,368	-	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 17 G one row expanded insulator 2-20 Fischer Elektronik	2,506	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	17	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 38 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,426	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 56 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,614	-	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 32 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	3,791	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 11 G one row expanded insulator 2-20 Fischer Elektronik	2,112	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	11	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

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