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Home > Products > Connectors, Interconnects > Rectangular Connectors > Headers, Male Pins

Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 3 SMD 048 19 G one row expanded insulator 2-20 Fischer Elektronik	3,702	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	19	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 34 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,841	-	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 28 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,097	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 28 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,965	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 70 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	1,535	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 48 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,778	-	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 50 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,288	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	50	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 20 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,106	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 20 G one row expanded insulator 2-20 Fischer Elektronik	1,667	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 22 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,017	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	22	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 68 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,086	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	68	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 32 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,378	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 22 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,631	-	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	22	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 080 54 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,024	-	RFQ	Datasheet	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	54	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 68 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,225	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	68	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 14 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,055	-	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	14	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 14 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,599	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	14	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 66 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,831	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 42 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	1,357	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	42	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 62 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	1,293	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

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