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Home > Products > Connectors, Interconnects > Rectangular Connectors > Headers, Male Pins

Headers, Male Pins

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 3 SMD 048 9 Z one row expanded insulator 2-20 Fischer Elektronik	4,947	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	9	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 073 13 Z SM one row expanded insulator 2-20 Fischer Elektronik	1,146	-	RFQ	Datasheet	SLV W 3 SMD 073	-	Active	Header	Male Pin	0.050" (1.27mm)	13	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	0.118" (3.00mm)	0.472" (12.00mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 62 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	1,888	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 18 G one row, wide isolation body, 4- Fischer Elektronik	1,002	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 56 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,345	-	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 24 Z one row expanded insulator 2-20 Fischer Elektronik	3,722	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 4 036 38 G two rows 4-72 contacts Fischer Elektronik	2,573	-	RFQ	Datasheet	SLV W 4 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 14 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,702	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	14	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 048 22 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	2,789	-	RFQ	Datasheet	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	22	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 3 SMD 048 24 G SM one row expanded insulator 2-20 Fischer Elektronik	2,838	-	RFQ	Datasheet	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 38 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	4,827	-	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 KA 055 36 G suitable for female header BLM Fischer Elektronik	2,622	-	RFQ	Datasheet	SLV W 1 KA 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 SMD 073 68 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	1,629	-	RFQ	Datasheet	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	68	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 080 44 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,277	-	RFQ	Datasheet	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 127 26 G one row, wide isolation body, 4- Fischer Elektronik	2,502	-	RFQ	Datasheet	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 KA 105 34 G suitable for female header BLM Fischer Elektronik	1,678	-	RFQ	Datasheet	SLV W 1 KA 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 8 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	3,886	-	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	8	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 46 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	1,393	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	46	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 9 SMD 102 23 Z one row, wide isolation body, 4- Fischer Elektronik	2,311	-	RFQ	Datasheet	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	23	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 054 64 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	2,375	-	RFQ	Datasheet	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	64	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

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